发明名称 Temperature control method and temperature control device
摘要 In a temperature control method, a controlled part is arranged to contact a first principal surface of a heat conduction part. The heat conduction part has the first principal surface and a second principal surface opposite to the first principal surface. The first principal surface has a configuration corresponding to a configuration of the controlled part. The second principal surface is larger in surface area than the first principal surface. At least one of a heating unit and a cooling unit is driven to set the controlled part at a predetermined temperature. The heating unit and the cooling unit are disposed on the second principal surface of the heat conduction part so that the heating unit and the cooling unit are arranged side by side.
申请公布号 US7921906(B2) 申请公布日期 2011.04.12
申请号 US20060350894 申请日期 2006.02.10
申请人 FUJITSU SEMICONDUCTOR LIMITED 发明人 MARUYAMA SHIGEYUKI;MISAWA HIROSHI;KOHASHI NAOHITO
分类号 F25D21/14 主分类号 F25D21/14
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