| 摘要 |
PROBLEM TO BE SOLVED: To provide a holding jig for a semiconductor wafer which prevents the peeling of a holding layer from a holding frame even if the diameter of the semiconductor wafer is 450 mm or more and which prevents the holding frame from becoming large and gaining weight and a peripheral device from becoming heavy and large. SOLUTION: There is provided a holding jig in which a hollow portion 2 of a holding frame 1 surrounding aϕ450 mm semiconductor wafer W is covered with a self-adhesive holding layer 10, and the surface of the holding jig 10 is made to hold the semiconductor wafer W adhesively in a detachable manner. A groove 11 to be fit is formed in a rear surface circumference direction of the holding frame 1. An elastic linear body 20 is fit to the groove 11 to be fit detachably. The peripheral portion of the holding layer 10 is sandwiched by the groove 11 to be fit and the linear body 20. Since the peripheral portion of the holding layer 10 is sandwiched by the groove 11 to be fit and the linear body 20, even if the area of an adhesion region 4 of the rear surface of the holding frame 1 is not enough, the holding layer 10 is never peeled off. COPYRIGHT: (C)2011,JPO&INPIT |
