| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem wherein a substrate and a substrate holder may be fixed to each other, in a process of a plurality of pressing and heating substrates to be joined to one another. SOLUTION: This method for peeling a substrate includes: a heating process of heating a holder with a substrate held thereto; and a peeling process of peeling the substrate from the holder by cooling the heated holder by providing a temperature gradient. The heating process includes processes of: sandwiching a plurality of substrates between a pair of holders in the thickness direction to be held; heating the pair of holders and the plurality of substrates; and sticking the plurality of substrates to one another by pressing the pair of holders. COPYRIGHT: (C)2011,JPO&INPIT |
