| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method thereof, which prevent a damage of a corner part of a semiconductor chip, and also to provide a wafer lamination structure which is used for manufacturing of the semiconductor device. SOLUTION: A first semiconductor wafer W1 and a second semiconductor wafer W2 are joined keeping their surfaces faced with an underfill U held therebetween. After they are joined, a rear of the second semiconductor wafer W2 is ground. Through the grinding, the underfill U moved into a groove G2 is exposed in the rear of the semiconductor wafer W2. Thereafter, a rear of the first semiconductor wafer W1 is ground. Through the rear grinding, the underfill U moved into the groove G1 is exposed in the rear of the semiconductor wafer W1. Then, it is subjected to dicing on a dicing line L, and a semiconductor device is obtained. COPYRIGHT: (C)2011,JPO&INPIT |
