发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
摘要 |
Disclosed herein is a printed circuit board, including: a base substrate; insulation layers which are formed on both sides of the base substrate and in which trenches are formed; and circuit layers including circuit patterns and vias formed in the trenches using a plating process. The printed circuit board is advantageous in that trenches are formed in both sides of a base substrate, so that a fine circuit pattern can be simultaneously formed on both sides thereof, thereby simplifying the manufacturing process thereof.
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申请公布号 |
US2011079421(A1) |
申请公布日期 |
2011.04.07 |
申请号 |
US20090634520 |
申请日期 |
2009.12.09 |
申请人 |
KO YOUNG GWAN;WATANABE RYOICHI;LEE SANG SOO;PARK SE WON |
发明人 |
KO YOUNG GWAN;WATANABE RYOICHI;LEE SANG SOO;PARK SE WON |
分类号 |
H05K1/11;B05D5/12;C23F1/00;C25D5/00 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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