METHOD OF FORMING SOLDER RESIST

摘要

PROBLEM TO BE SOLVED: To provide a method of forming a solder resist capable of forming a high precision solder resist pattern with a proper thickness, without generating bubbles or an uncovered portion of an edge of conductor wiring. SOLUTION: The method of forming the solder resist includes the steps of: forming a solder resist film on the surface of a circuit board; thinning approximately uniformly the whole surface of the solder resist film by alkali aqueous solution treatment; executing pattern exposure and development; and further executing post-cure. COPYRIGHT: (C)2011,JPO&INPIT