METAL MICROPARTICLE DISPERSION, PROCESS FOR PRODUCTION OF ELECTRICALLY CONDUCTIVE SUBSTRATE, AND ELECTRICALLY CONDUCTIVE SUBSTRATE

摘要

Disclosed are: a metal microparticle dispersion having excellent dispersibility; an electrically conductive substrate produced using the metal microparticle dispersion and having excellent electrical conductivity; and a process for producing the electrically conductive substrate. Specifically disclosed are: a metal microparticle dispersion comprising metal microparticles, a polymeric dispersant, and a dispersion medium, and characterized in that the metal microparticles have an average primary particle diameter of 0.001 to 0.5 µm, and that the polymeric dispersant has a polyester skeleton in at least one of the main chain or a side chain thereof, the polyester skeleton has at least one of a valerolactone-derived constituent unit and a caprolactone-derived constituent unit, and the total number of constituent units is 10 or more on average, or that the polymeric dispersant has a polyether skeleton in at least one of the main chain and a side chain thereof, and the content of the polymeric dispersant is 0.1 to 100 parts by mass relative to 100 parts by mass of the metal microparticles; a process for producing an electrically conductive substrate, comprising printing a coating solution containing the metal microparticle dispersion in a pattern-like form to form a printed layer and burning the printed layer to form a pattern-like burned metal microparticle film; and an electrically conductive substrate produced by the process.