IMAGE SENSOR MODULE, METHOD OF MANUFACTURING THE SAME, IMAGING DEVICE INCLUDING THE IMAGE SENSOR MODULE AND METHOD OF MANUFACTURING THE IMAGING DEVICE

摘要

PURPOSE: An image sensor module, image pickup device including an image sensor module, and manufacturing method thereof are provided to supply a wafer level image sensor module including a dehumidifying function. CONSTITUTION: An image sensor chip(111) generates an image signal by photoelectric conversion. An image sensor package(100) includes a lower transparent substrate that is arranged in the upper part of the image sensor chip. An upper transparent substrate includes at least one lens which condenses light to the image sensor chip. An adhesive member is arranged between lower and upper transparent substrates. An image sensor module(500) includes dehumidifying agent that is inserted inside the adhesive member.