| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which has good alkali developability and a high initial reflectance, ensures a small reduction in the reflectance after UV irradiation and heating, and hardly causes the problem of discoloration after heating, and to provide a solder resist composition for a printed wiring board and a printed wiring board using the same. <P>SOLUTION: The photosensitive resin composition includes (A) a carboxyl group-containing photosensitive resin, (B) a phenolic compound represented by general formula (I), (C) an organic sulfur compound represented by general formula (II): (R<SP>3</SP>-S-CH<SB>2</SB>CH<SB>2</SB>COOCH<SB>2</SB>)<SB>4</SB>C, (D) a photopolymerization initiator, (E) a diluent, (F) an epoxy compound, and (G) a colorant, wherein R<SP>1</SP>and R<SP>2</SP>each independently denote H, methyl, ethyl or butyl in the general formula (I), and wherein R<SP>3</SP>denotes 10-20C alkyl and four R<SP>3</SP>s may be the same or different in the general formula (II). <P>COPYRIGHT: (C)2011,JPO&INPIT |
