SHEET-LIKE ADHESIVE AND TAPE FOR WAFER PROCESSING

摘要

PROBLEM TO BE SOLVED: To provide a sheet-like adhesive, materials of which are easily stored and which permits high production efficiency and hardly suffers from deterioration with time in adhesive force and is easily stored, and a tape for wafer processing prepared using the sheet-like adhesive. SOLUTION: The sheet-like adhesive 12 comprises a curable resin curable by heat or a high-energy ray and an epoxy-curing agent for curing epoxy, where a part or the whole of the curable resin is a chelate-modified epoxy resin and the content of the chelate-modified epoxy resin in the components of the curable resin is at least 10 mass%. COPYRIGHT: (C)2011,JPO&INPIT