| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an integrated circuit which has a miniaturized current sensor in an integrated circuit package. <P>SOLUTION: This integrated circuit includes a lead frame which has a plurality of lead wires and has a current conductor part equipped with at least two of the lead wires in a plurality, and a substrate which has a first surface and a second surface opposite to the first, the first surface being located close to the current conductor part, the second surface being located far from the current conductor part, each one of the lead wires having the respective length and each one of the lead wires having a curvature in the direction so selected as to be closer to the first surface of the substrate than to the second surface of the substrate over the whole length of the lead wire. The circuit includes an insulating layer which is provided between the substrate and the current conductor part of the lead frame, and one or a plurality of magnetic field converters which are provided on the first surface of the substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT |
