发明名称 SUBSTRATE PROCESSING METHOD AND APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing method and apparatus, capable of preventing the collapse of a pattern formed on the surface of a substrate more reliably. SOLUTION: In the way of a transfer system to a processing unit, ozone gas is sprayed to a substrate carried out from a carrier in order to remove organic contaminations. The substrate is carried in the processing unit after organic contaminations are removed from the surface thereof and is subjected to chemical surface treatment, so that uniform surface treatment can be performed on the entire surface of the substrate. After completing the chemical treatment, the substrate is subjected to pure water rinse treatment and then hydrophobic treatment is performed by supplying HMDS as a hydrophobic agent to the surface of the substrate. The capillary force of a droplet remaining in the pattern on the surface of the substrate becomes close to zero, thereby pattern collapse can be prevented during the drying. In the way of the transfer system back to the carrier, ozone gas is sprayed again to the substrate subjected to hydrophobic treatment and hydrophobic state is released. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011071169(A) 申请公布日期 2011.04.07
申请号 JP20090218729 申请日期 2009.09.24
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 KITAGAWA HIROAKI;MIYA KATSUHIKO
分类号 H01L21/304;G03F7/38;H01L21/027;H01L21/306 主分类号 H01L21/304
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