发明名称 WIRING BOARD AND METHOD FOR MANUFACTURING SAME
摘要 <p>A wiring board has a first rigid wiring board having an accommodation section, a second rigid wiring board to be accommodated in the accommodation section, and an insulation layer formed on the first rigid wiring board and the second rigid wiring board. Here, a conductor of the first rigid wiring board and a conductor of the second rigid wiring board are electrically connected to each other, and at least either a side surface of the second rigid wiring board or a wall surface of the accommodation section has a concave-convex portion.</p>
申请公布号 KR20110034027(A) 申请公布日期 2011.04.04
申请号 KR20117004214 申请日期 2010.05.14
申请人 IBIDEN CO., LTD. 发明人 AOYAMA MASAKAZU;NOGUCHI HIDETOSHI
分类号 H05K1/14;H05K3/46 主分类号 H05K1/14
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