| 摘要 |
PROBLEM TO BE SOLVED: To provide a constitution, in which shield measures and heat dissipation measures can be effectively taken for a radio substrate, on which an electronic circuit configured to perform signal processing for radio communication is formed, in a radio communication device which is disposed on an IC (Integrated Circuit) chip mounted on a main substrate. SOLUTION: The radio communication device has a radio substrate 30, on which the electronic circuit configured to perform the signal processing for radio communication is formed, mounted on the main substrate 20. The radio substrate 30 is arranged on the IC chip 23 mounted on an upper surface of the main substrate 20 so as to have a gap between the radio substrate 30 and the IC chip 23. The radio communication device is provided with a shield and heat dissipation plate 40 which is connected to the IC chip 23 in a heat conduction enable state and which covers over an electronic component group mounted on an upper surface of the radio substrate 30. COPYRIGHT: (C)2011,JPO&INPIT
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