COOLING DEVICE FOR ELECTRONIC PARTS

摘要

The present invention relates to a cooling device for electronic parts. The cooling device for electronic parts comprises: a first heat pipe which is formed with a wick on its inner circumferential surface, and which has a contact surface making contact with a heat-emitting part and has at least one receiving recess formed on the contact surface; a second heat pipe which is formed with the wick on its inner circumferential surface, and which has a contact portion which is inserted in the receiving recess and makes contact with the heat-emitting part; and a plurality of heat-dissipating fins which are disposed spaced apart from each other on the upper side of the heat-emitting part and are joined to the first heat pipe and the second heat pipe.