发明名称 |
Conductive paste and method of manufacturing printed circuit board using the same |
摘要 |
The present invention provides a conductive paste including: a conductive powder particle including a polymer powder and a first low melting point metal and a second low melting point metal which are sequentially provided on a surface of the polymer powder and have different melting points; and a binder mixed in the conductive powder particle, and a method of manufacturing a printed circuit board using the same.
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申请公布号 |
US2011073252(A1) |
申请公布日期 |
2011.03.31 |
申请号 |
US20100656019 |
申请日期 |
2010.01.13 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
HWANG JUN OH;MOK JEE SOO;LEE EUNG SUEK |
分类号 |
H05K3/12;B32B38/14;H01B1/00;H01B1/02 |
主分类号 |
H05K3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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