TILED MANIFOLD FOR A PAGE WIDE PRINTHEAD

摘要

An ink manifold constructed with a number of semiconductor tiles which are fastened end to end on a rigid base member to form a page wide print mechanism. Each tile is constructed with ink channels on one side in liquid communication with ink outlet ports on the opposite side. The ink channels carry ink from ports in the base member to the outlet ports of the tiles. The interface between each tile defines a boundary. An inkjet printhead is fastened over each boundary of the tiled manifold so that the ink inlet ports of the printhead are aligned with the ink outlet ports of the underlying tiles. No ink passes across the boundary of the adjacent manifold tiles. The fabrication of the individual tiles from a semiconductor wafer facilitates usage of the wafer when fabricating page wide print mechanisms.