发明名称 |
Apparatus And Methods Of Forming An Interconnect Between A Workpiece And Substrate |
摘要 |
Embodiments of an apparatus and methods of forming interconnect between a workpiece and substrate and its application to packaging of microelectronic devices are described herein. Other embodiments may be described and claimed. |
申请公布号 |
US2011074023(A1) |
申请公布日期 |
2011.03.31 |
申请号 |
US20100956141 |
申请日期 |
2010.11.30 |
申请人 |
SUPRIYA LAKSHMI;PRAKASH ANNA M;ASHTON TOMMY L |
发明人 |
SUPRIYA LAKSHMI;PRAKASH ANNA M.;ASHTON TOMMY L. |
分类号 |
H01L23/52;H01L21/56 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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