| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To make a mounting substrate in which an electrostatic capacitive element is built compact by limiting the size of the mounting substrate. <P>SOLUTION: An uneven shape A is formed on a top surface of a resin substrate, and a conductor is directly deposited so as to cover a top surface of the uneven shape of the resin substrate to form a lower electrode 20. A dielectric is directly deposited so as to cover a top surface of the lower electrode to form a dielectric film 21, and a conductor is directly deposited so as to cover a top surface of the dielectric film to form an upper electrode 22. A resin layer is formed on the upper electrode, and wiring is formed on the resin layer. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
