发明名称 PRESSING DEVICE AND PRESSING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a bonding technique which can bond two objects to be bonded with higher accuracy. <P>SOLUTION: Objects to be bonded 91 and 92 are relatively moved in a Z direction, and the object to be bonded 91 and the object to be bonded 92 is brought into contact with each other (step S13). A position gap &Delta;D of the objects to be bonded 91 and 92 in a horizontal direction is measured, in a state where the objects to be bonded 91 and 92 are made to come into contact with each other (step S14). Then, the objects to be bonded 91 and 92 are moved relatively in a horizontal direction, the alignment of the objects to be bonded 91 and 92 are carried out again, and the position gap &Delta;D is corrected (step S17). <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011066287(A) 申请公布日期 2011.03.31
申请号 JP20090216985 申请日期 2009.09.18
申请人 BONDTECH INC 发明人 YAMAUCHI AKIRA
分类号 H01L21/60;H01L21/02 主分类号 H01L21/60
代理机构 代理人
主权项
地址