| 摘要 |
PROBLEM TO BE SOLVED: To bond a semiconductor chip completely to a substrate having a wiring pattern through a thermosetting adhesive sheet so as not to incorporate air bubbles between the adhesive sheet and the substrate. SOLUTION: In this device 1 for bonding a semiconductor chip, a bonding object D with semiconductor chips C temporarily fixed on a substrate CB through a thermosetting adhesive sheet S is heated to bond the semiconductor chips. The device includes: a heating furnace 14 including a heating means 18; a pressurization means 27 to supply a predetermined gas into the heating furnace 14 to pressurize the interior of the heating furnace 14; an air guide means 15 arranged to surround at least the bonding object D in the heating furnace 14; and a blast means 21 to guide a gas in the heating furnace 14 heated by the heating means 18 in the direction of the bonding object D. The inside of the air guide means 15 forms a downwind passage 16 of the heated gas, and the outside of the air guide means 15 and the inner wall of the heating furnace 14 form an upwind passage 17 for guiding the gas having passed through the bonding object D in the direction of the blast means 21. COPYRIGHT: (C)2011,JPO&INPIT |
