发明名称 |
Heat Dissipating Device and Module Using Same |
摘要 |
The present invention relates to a heat dissipating device adapted for use in combination with a module provided with a mounting board. The heat dissipating device has a metallic heat-dissipating member including a body and a number of spaced-apart heat dissipating fins extending upwardly from the upper surface of the body. The body is formed at its central portion with a through hole adapted for receiving a protrusion block protruding from a back surface of the mounting board of the module opposite to a mounting surface on which electrical devices are mounted. The heat dissipating device further includes a pump unit, a fluid conduit and a fan unit disposed on the heat dissipating fins.
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申请公布号 |
US2011073159(A1) |
申请公布日期 |
2011.03.31 |
申请号 |
US20100890912 |
申请日期 |
2010.09.27 |
申请人 |
SHEN YU-NUNG;WANG TSUNG-CHI |
发明人 |
SHEN YU-NUNG;WANG TSUNG-CHI |
分类号 |
F21V7/00;F21V29/00;F28D15/00;F28F13/12;H01L31/052;H05K7/20 |
主分类号 |
F21V7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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