METHOD OF FABRICATING A PRINTED CIRCUIT BOARD WITH IMPROVED HEAT DISSIPATION

摘要

PURPOSE: The manufacturing method of PCB in which the protection against heat characteristic betters. Copper is used as the heatsink ash. CONSTITUTION: The insulating layer(100) and weight copper foil are laminated and substrate is formed on the internal layer. The drill bit is processed in the weight copper foil site forming the copper circuit. The copper foil in which the thickness thins down is by etching removed selectively. The circuit selected is kiled in action in the time heartburnings copper foil and the copper circuit is formed.