发明名称 |
Production of integrated circuit chip packages prohibiting formation of micro solder balls |
摘要 |
Methods for making, and structures so made for producing integrated circuit (IC) chip packages without forming micro solder balls. In one embodiment, a method may include placing a solid grid made from an organic material between the IC chip and the substrate. The grid provides a physical barrier between each of a plurality of Controlled Collapse Chip Connections, and thereby prevents the formation of micro solder balls between them, thus improving chip performance and reliability.
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申请公布号 |
US7915732(B2) |
申请公布日期 |
2011.03.29 |
申请号 |
US20080164447 |
申请日期 |
2008.06.30 |
申请人 |
INTERNATIONAL BUSINESS MAHINES CORPORATION |
发明人 |
AYOTTE STEPHEN P.;GILBERT JEFFREY D.;HILL DAVID J.;MENDELSON RONALD L.;SULLIVAN TIMOTHY M. |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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