发明名称 Laser diode epitaxial wafer and method for producing same
摘要 A laser diode epitaxial wafer includes an n-type GaAs substrate, an n-type cladding layer formed on the n-type GaAs substrate, an active layer formed on the n-type cladding layer, and a p-type cladding layer formed on the active layer. The n-type cladding layer, the active layer, and the p-type cladding layer include an AlGaInP-based material. The p-type cladding layer has carbon as a p-type impurity. The p-type cladding layer has a carrier concentration between 8.0×1017 cm−3 and 1.5×1018 cm−3.
申请公布号 US7915634(B2) 申请公布日期 2011.03.29
申请号 US20100656976 申请日期 2010.02.22
申请人 HITACHI CABLE, LTD. 发明人 KUROSU KEN
分类号 H01L33/00;H01L21/205;H01S5/323 主分类号 H01L33/00
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