发明名称 Method of fabricating T-gate
摘要 A method of fabricating a T-gate is provided. The method includes the steps of: forming a photoresist layer on a substrate; patterning the photoresist layer formed on the substrate and forming a first opening; forming a first insulating layer on the photoresist layer and the substrate; removing the first insulating layer and forming a second opening to expose the substrate; forming a second insulating layer on the first insulating layer; removing the second insulating layer and forming a third opening to expose the substrate; forming a metal layer on the second insulating layer on which the photoresist layer and the third opening are formed; and removing the metal layer formed on the photoresist layer. Accordingly, a uniform and elaborate opening defining the length of a gate may be formed by deposition of the insulating layer and a blanket dry etching process, and thus a more elaborate micro T-gate electrode may be fabricated.
申请公布号 US7915106(B2) 申请公布日期 2011.03.29
申请号 US20080270016 申请日期 2008.11.13
申请人 ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE 发明人 SHIM JAE YEOB;YOON HYUNG SUP;KANG DONG MIN;HONG JU YEON;LEE KYUNG HO
分类号 H01L21/338;H01L21/28;H01L21/44 主分类号 H01L21/338
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