| 摘要 |
An information sensing device includes a substrate, one information sensing chip, one electroconductive structure and a molded body. An electrical output portion including output connections is formed on the substrate. The information sensing chip is electrically connected to the electrical output portion and has one bottom chip surface mounted on the substrate, and one top chip surface to be close to or in contact with an object to sense specific information of the object. The electroconductive structure is electrically connected to the electrical output portion. The molded body is in contact with the information sensing chip and the at least one electroconductive structure to expose the top chip surface and a first surface of the electroconductive structure. The top chip surface is disposed opposite the bottom chip surface. The top chip surface and the first surface are exposed outside and disposed on substantially the same plane. |
