| 摘要 |
A solid-state image pickup device which includes a circuit board provided with a hole and with a circuit layer formed thereon, a solid-state image pickup element housed in the hole and having an upper surface constituting a light-receiving face and electrodes formed on a peripheral portion of the upper surface, and a glass plate disposed over the light-receiving face and provided with a connecting conductive layer which is extended from the underside of the glass plate, via the sidewall of the glass plate, to the upper surface of the glass plate. The electrode is electrically connected with the connecting conductive layer formed on the underside of glass plate, and the connecting conductive layer is electrically connected with the circuit layer formed on the upper surface of the circuit board. |
