| 摘要 |
PROBLEM TO BE SOLVED: To provide a non-cylindrical via-structure for satisfying a requirement of the heat dissipation of a high-power electronic device, and to provide a heat transfer accelerating substrate having the non-cylindrical via-structure. SOLUTION: A heat transfer accelerating substrate having a non-cylindrical via-structure includes at least one metal layer deposited on an insulating base material and a plurality of heat channels. Each of the heat channels comprises at least one through-pattern penetrating the insulating base material and a conductive material deposited in the through-pattern. The through-pattern works as the non-cylindrical via-structure having at least one elongate hole for heat dissipation, and reduces an operating temperature of an electronic device. COPYRIGHT: (C)2011,JPO&INPIT
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