发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus that eliminates unnecessary energy during temperature rising of piping and can efficiently raise temperature. SOLUTION: The substrate processing apparatus includes: a processing container for processing a substrate; a gas supply system for supplying gas into the processing container; an exhaust system for exhausting the inside of the processing container; a plurality of heating units for heating contact gases in the processing container, the gas supply system and the exhaust system; and a control unit for setting temperature rising start time of the other heating units so that temperature rising may be completed at a time when the temperature rising of a heating unit having the longest rising temperature time among the plurality of heating units is completed. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011061002(A) 申请公布日期 2011.03.24
申请号 JP20090209115 申请日期 2009.09.10
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 TAKADERA HIROYUKI
分类号 H01L21/31;C23C16/455 主分类号 H01L21/31
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