| 摘要 |
PROBLEM TO BE SOLVED: To provide a jig for wiring substrate reflow which suppresses the warpage of a substrate by a temperature in a reflow furnace and, at the same time, does not need to raise a temperature in the reflow furnace to a temperature still higher than a solder melting temperature. SOLUTION: In order to solve the problem, the jig for wiring substrate reflow has a jig cover which supports the wiring substrate from the front surface side of the wiring substrate and a jig base which supports the wiring substrate from the rear side of the wiring substrate. Openings are provided in the jig cover and the jig base, respectively. When reflow soldering is performed, the wiring substrate is sandwiched between the jig cover and the jig base. Thereby, the warpage of the substrate can be suppressed without raising the temperature in the reflow furnace more than necessary. COPYRIGHT: (C)2011,JPO&INPIT
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