SEMICONDUCTOR PACKAGE HAVING ELECTROMAGNETIC WAVES SHIELDING AND HEAT EMISSION MEANS

摘要

PURPOSE: A semiconductor package with an electromagnetic wave shielding and heat emitting unit is provided to easily emit heat generated in each chip to a substrate or the outside through a heat spreader, thereby maximizing a heat emitting effect. CONSTITUTION: A logic chip(12) is electrically connected onto a substrate(10). A plurality of memory chips(16) is electrically connected through a plurality of though silicon vias(14). The memory chips are vertically stacked on the logic chip. The memory chips are smaller than the logic chip. A molding resin(18) is molded on the substrate to seal the logic chip and the memory chips. A through via(20) is formed from an upper surface of the molding resin to an upper part of the frame of the logic chip. A molding resin through via is filled with a conductive material(22). An electromagnetic wave shielding and heat emitting unit(30) is coated by an electromagnetic shielding material(24).