| 摘要 |
PROBLEM TO BE SOLVED: To provide a connection method and a structure for connecting a high-frequency line to an internal wiring board without deteriorating characteristics in a module package having a high-frequency line composed of glass feed-through, and a package having the structure. SOLUTION: The connection structure is provided with a sidewall 10 of a package having a glass feed-through 11 that passes a high-frequency electrical signal therethrough, and a wiring board 14 for propagating the high-frequency electrical signal to an electronic device or an optical device mounted in the package. In connecting the center conductor 12 of the glass feed-through 11 to a signal line 15 of the wiring board 14, the center conductor 12 and the signal line 15 are abutted on each other in the propagating direction of the high-frequency electrical signal to connect themselves. COPYRIGHT: (C)2011,JPO&INPIT |
