| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper thin film capable of maintaining a low volume resistivity for a long period of time, and to provide a method for producing the copper thin film from a copper particle dispersion. SOLUTION: The method for producing the copper thin film includes at least two processes comprising a process (A) for applying a heating treatment using overheated steam to a coated film containing a copper particle dispersion, and a process (B) for applying a rust preventive treatment to the copper thin film layer obtained in the process (A). The copper thin film produced by the method is also provided. It is preferable that the coated film is a film obtained by applying the copper particle dispersion on an insulating substrate by coating or printing. COPYRIGHT: (C)2011,JPO&INPIT |
