HEAT TRANSFER ARRANGEMENT AND ELECTRONIC HOUSING COMPRISING A HEAT TRANSFER ARRANGEMENT
摘要
<p>A heat transfer arrangement for heat exchange between an inside of an electronic component housing and an ambient environment. The heat transfer arrangement comprises a refrigerant circuit with an evaporator a condenser and conduits (202). A refrigerant is arranged to self-circulate in a refrigerant flow in the refrigerant circuit. A flow control device (124) comprises a movable member (206) adapted to control the refrigerant flow. The movable member (206) affects a through flow area of one of the conduits (202). The movable member (206) is adapted to move in response to a pressure change inside the refrigerant circuit by being affected from a first side by a refrigerant pressure inside the refrigerant circuit and from a second side by a spring force such that the refrigerant flow is changed.</p>
申请公布号
WO2011034472(A1)
申请公布日期
2011.03.24
申请号
WO2009SE51020
申请日期
2009.09.15
申请人
TELEFONAKTIEBOLAGET L M ERICSSON (PUBL);KAELLMARK, MAGNUS;HEDBERG, KLAS;JONSSON, FREDRIK