| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a chip having a bump electrode, in which a contact area between the bump electrode and a substrate is increased and defective joint due to adhesion of contamination thereto hardly occurs, and to provide a method of manufacturing the chip. <P>SOLUTION: The bump electrode formed on a surface of a component includes: a plurality of metal bumps formed on the surface of the component, a flat part or a recess formed at the tip end of each of the metal bumps, and a large number of wrinkles or grooves radially formed in the flat part or the recess. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
