| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To segment a workpiece along a predetermined segmentation lines with high accuracy. <P>SOLUTION: A processing method includes: a first reforming region formation step of forming a first reforming region 111 in line with a first segmentation schedule line and a second segmentation schedule line near the surface of the workpiece 1; a second reforming region formation step of forming a second reforming region 113 in a cross region of the first segmentation schedule line and the second segmentation schedule line at a prescribed position between the backside of the workpiece 1 and the first reforming region 111 formed in the interior of the workpiece 1 by the first reforming region formation step; and a segmentation step of segmenting this workpiece 1 into individual chips in line with the first segmentation schedule line and the second segmentation schedule line by applying external force to the workpiece 1 for which the first reforming region 111 and second reforming region 113 are formed. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
