| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing device capable of removing an unnecessary film from a substrate while suppressing or preventing damage of the substrate. SOLUTION: This substrate processing device 1 includes: a spin chuck 7 for holding a wafer W; a chemical supply unit 22 for supplying a processing liquid containing a photoactivation component activated by being irradiated with light to the wafer W held to the spin chuck 7; and an irradiation unit 4 for irradiating the processing liquid containing the photoactivation component to be supplied to the wafer W held to the spin chuck 7 with light. COPYRIGHT: (C)2011,JPO&INPIT
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