发明名称 DEPOSITION METHOD AND APPARATUS
摘要 A method of depositing a material on a substrate comprises placing a substrate into a process space in fluidic communication with a Gaede pump stage (GPS). A precursor gas is then injected into the process space while injecting a draw gas at a draw gas flow rate into the GPS such that the injected precursor gas achieves a precursor pressure and a precursor gas flow rate in the process space. Subsequently, substantially all of the precursor gas remaining in the process space is swept from the process space by injecting a sweep gas into the process space such that the injected sweep gas achieves a sweep pressure and sweep gas flow rate in the process space. The precursor pressure is higher than the sweep pressure, and the precursor gas flow rate is lower than the sweep gas flow rate.
申请公布号 US2011070141(A1) 申请公布日期 2011.03.24
申请号 US20090991918 申请日期 2009.05.06
申请人 SUNDEW TECHNOLOGIES LLC 发明人 SNEH OFER
分类号 C01B15/14;C01B33/00;C01B33/20;C01C1/28;C01F7/02;C01G35/00;C01G41/02;C23C16/448;F04B35/00 主分类号 C01B15/14
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