| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a pattern forming method that can reduce pattern defect in an imprint lithography method used for the manufacture of semiconductor device or the like. <P>SOLUTION: The pattern forming method can include selectively providing a curing agent to a pattern in a template having the pattern, contacting the template provided the curing agent to a substrate, irradiating the curing agent with light where the template and the substrate are contacted each other to harden the curing agent, demolding the template from the substrate to form a curing agent pattern on the substrate after the curing agent is hardened, and processing the substrate on a basis of the curing agent pattern. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
