| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device with which a pick-up process of a semiconductor chip can be validated accurately. SOLUTION: For example, for a semiconductor wafer WF already picked up, images for each line are imaged by using a line camera LCM, and the map data obtained from an imaged data group 31 and wafer map data WMD, obtained by a probe inspection, are checked by an automatic checking means 32. When map data are obtained from the imaged data group 31, a dicing groove 10 formed on a dicing sheet DS by a blade in dicing is detected, the chip coordinate is recognized, according to the position relation between the compartment of the dicing groove 10 and a standard chip CP_R, and the map data are generated, based on the presence or absence of the chip CP in each chip coordinate. COPYRIGHT: (C)2011,JPO&INPIT |
