| 摘要 |
PROBLEM TO BE SOLVED: To provide a conveyance mechanism allowed to be downsized by shortening a conveying stroke when conveying a workpiece between a cassette and a working area of a workpiece and to provide a processing apparatus including the conveyance mechanism. SOLUTION: In one direction from a storing area A1 to a working area A3, a semiconductor wafer W held by a first holding part 71 is drawn out from the storing area A1 to a temporary placing area A2 and a push-pull arm 61 is moved around to the rear end side of the semiconductor wafer W in the temporary placing area A2 so that the semiconductor wafer W is pressed into the working area by a second abutting part 75. In the other direction from the working area A3 to the storing area A1, the semiconductor wafer W held by a second holding part 72 is drawn out from the working area A3 to the temporary placing area A2 and the push-pull arm 61 is moved around to the rear end side of the semiconductor wafer W in the temporary placing area A2 so that the semiconductor wafer W is pushed into the storing area A1 by a first abutting part 74. COPYRIGHT: (C)2011,JPO&INPIT |
