| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve a problem that a warp occurs due to stress generated by a difference between thermal expansion coefficients of two members since a plurality of light-emitting element chips are disposed in a long groove formed by sticking a circuit board to a reflective frame or by sticking the circuit board to a heat radiating substrate. <P>SOLUTION: Light-emitting element chips 2-1, 2-2, ..., and circuit chips 3-1, 3-2, ..., are alternately arranged on the bottom of a long groove 1a of a substrate 1 having the long groove 1a, and electrically connected in series via bonding wires 4-1, 4-2 .... <P>COPYRIGHT: (C)2011,JPO&INPIT |
