| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly tough and highly thermally conductive thermosetting resin composition for molds that reduces peeling and cracks occurred between a mold cured product and an insulated cylinder. SOLUTION: A resin cured product of the highly tough and highly thermally conductive thermosetting resin composition for molds is provided. In the cured product of the thermosetting resin composition containing a polyfunctional epoxy resin having two or more epoxy groups per molecule, a curing agent of an acid anhydride, an inorganic filler, and a surfactant, the stress safety factor is 7 or more, the strain safety factor is 10 or more, the permissible defect size is 0.1 mm or more, and the thermal conductivity of the cured product is 0.7 to 2.5 W/m×K when mold of alumina ceramics with the composition and cooling the same to room temperature are performed. COPYRIGHT: (C)2011,JPO&INPIT |
