| 摘要 |
PROBLEM TO BE SOLVED: To provide a silicone composition that provides sufficient adhesive strength to various package materials comprising a thermoplastic resin, such as an LCP (liquid crystal polymer) hard to be adhered, and that provides a cured product having transparency, and also to provide a cured product of the composition, and a semiconductor device sealed by the cured product. SOLUTION: The silicone composition contains (A) an organopolysiloxane containing at least two alkenyl groups in one molecule, (B) an organohydrogenpolysiloxane containing at least two hydrogen atoms bonded to a silicon atom in one molecule, (C) a platinum group metal-based catalyst, and (D) an isocyanuric ring-containing organosiloxane having an allyl group, an epoxy group, and an organosiloxy group in one molecule. COPYRIGHT: (C)2011,JPO&INPIT
|
