| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thermal compression bonding apparatus capable of shortening a cycle time, when thermally compression-bonding a component on one side of a substrate, and a component on the other side of the substrate. <P>SOLUTION: The device includes a stage 2, drivably provided for holding the substrate at the upper surface, and a plurality of thermal compression-bonding mechanisms 11, 12 for simultaneously thermally compression-bonding anisotropic conductive members 34 to at least two sides of the substrate held by the stage, respectively. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
