| 摘要 |
PROBLEM TO BE SOLVED: To improve variation in thickness of a sliced work (a wafer). SOLUTION: According to this slicing method for a work, in slicing the work, previously the work is pressed and moved to a slicing wire at the stop of running the slicing wire, the tension is measured in the vicinity of both tensing end parts of the slicing wire, and the work support direction is adjusted so that the two obtained tension measured values are the same. COPYRIGHT: (C)2008,JPO&INPIT |
