| 摘要 |
A method for manufacturing a multilayer ceramic electronic device, wherein leakage of an underfill resin for fixing a surface mount electronic device does not occur and high-density, high-accuracy mounting of a device can be conducted, and a highly reliable multilayer ceramic electronic device, which is produced by the above-described manufacturing method and which has excellent impact resistance and excellent compatibility with miniaturization, are provided. A resin introduction portion 11A located outside a vertically projected region R of a surface mount electronic device 13 is disposed on a seat portion 11 which contains a nonmetallic inorganic powder as a primary component and on which the surface mount electronic device, e.g., a semiconductor element, is mounted, and a resin 22 is supplied to the resin introduction portion so as to fill the resin into the seat portion and a gap between the seat portion and a multilayer ceramic element assembly 4. Unsintered ceramic base material layers (first ceramic layers 1) and shrinkage restriction layers (second ceramic layers 2) for restricting shrinkage of the unsintered ceramic base material layers in a plane direction are laminated and, thereby, an unfired multilayer ceramic element assembly is formed, which does not shrink in a direction orthogonal to a lamination direction in a firing step. |
