发明名称 APPARATUS AND METHOD FOR SELECTIVE PLATING USING A PLATING RESIST
摘要 PURPOSE: A partial plating apparatus and method using laser beam and an anti-plating film are provided to form complex fine plating patterns of several micro-meters to a uniform thickness. CONSTITUTION: A partial plating apparatus comprises an anti-plating film forming part(104), a laser beam irradiating part(106), a plating part(108), an anti-plating film removing part(110), and a transfer unit. The anti-plating film forming part forms an anti-plating film on a plated surface of a work piece. The laser beam irradiating part irradiates laser beam in the set pattern on the plated surface of the work piece. The plating part contains plating liquid in which the work piece is dipped. The anti-plating film removing part removes the anti-plating film from the plated surface of the work piece. The transfer unit transfers the work piece successively through the anti-plating film forming part, the laser beam irradiating part, the plating part, and the anti-plating film removing part.
申请公布号 KR20110029899(A) 申请公布日期 2011.03.23
申请号 KR20090087755 申请日期 2009.09.16
申请人 J-MICRON CO., LTD. 发明人 HWANG, HWA IEK;YOU, SUNG KUN;JANG, HO JIN;LIM, JEONG HYEOK
分类号 C25D5/02;C25D5/18;C25D17/00 主分类号 C25D5/02
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