发明名称 Heat conducting structure with coplanar heated portion, manufacturing method thereof, and heat sink therewith
摘要 <p>A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold (20) and a second mold (30) having different concave cambers (211, 211a, 221, 221a), using the first mold (20) to progressively compress the heat pipes (10) and form a camber (112) at an evaporating section (11), using the second mold (3 0) to compress the camber (112) to form a contact plane (112') and an attaching plane (113') perpendicular to each other, coating an adhesive (50) on the contact planes (112'), connecting the contact planes to make the attaching planes co-planar.</p>
申请公布号 EP2298490(A1) 申请公布日期 2011.03.23
申请号 EP20090011954 申请日期 2009.09.18
申请人 CPUMATE INC.;GOLDEN SUN NEWS TECHNIQUES CO., LTD. 发明人 LIN, KUO-LEN;LIN, CHEN-HSIANG;HSU, KEN;CHENG, CHIH-HUNG
分类号 B23P15/26;F28D15/02;F28F3/02;H01L21/48;H01L23/427 主分类号 B23P15/26
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